Newsletter #29
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Low Cost Lead-Free Soldering Technology to Improve Competitiveness of European SME
Contract n. COLL-CT-2004-500454
The electronics industry is facing a challenge. The Restriction of the use of certain of Hazardous Substances (RoHS) Directive, effective since July 2006, obliged many parts of the Industry to change from tin/lead solder used to join the electronic components to the printed circuit boards (PCB) to a lead-free solder (LFS).
The change to Lead-Free assembling gives rise a number of challenges: Materials selection and compatibility; Processing and equipment capability; Manufacturing yields and throughput; Functional performance; Establishment of reliability performance and baselines; Health and Safety.
LEADOUT, Low Cost Lead-Free Soldering Technology to Improve the Competitiveness of European SMEs
, one of the largest European funded Projects on lead-free technologies under the scope of 6th Framework SME oriented activities aimed at:
»
Developing/implementing no flow cost lead-free soldering processes to support SMEs in meet the EU directives
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Establishing process quality standards, reducing defect rates, improving reliability and, therefore, competitiveness
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Improving Health and Safety awareness and pollution prevention.
Fig. 1. Leadout European Team, 3rd General Assembly, Palazzo Clerici, Milan, 29 September 2006
For further information:
www.leadoutproject.com
Go on and visit us!
2
nd
LEADOUT Newsletter
1
st
LEADOUT Newsletter
LEADOUT on the Road: Environmental Results
LEADOUT on the Road: Soldering and Reliability Testing
LEADOUT on the Road: Photolibrary & Training
LEADOUT on the Road: Health and Safety – Flux Fume from Lead-Free Solder Wires
LEADOUT on the road – Training Courses
LEADOUT on the road - PhotoLibrary
LEADOUT on the road - Occupational Health
LEADOUT on the Road: Soldering Results
LEADOUT on the Road: Benchmarking of the Soldering Process - PPM Study and
Defects
Project Info - 185 Kb
RoHS Enforcement in LEADOUT EU Member States
980844
visitors since:
07.12.01
. Last Website update:
17.04.09
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